<?xml version="1.0" encoding="utf-8" standalone="yes"?>
<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom">
	<channel>
		<title>Flexible on Direct Infrared Heating Supply</title>
		<link>http://ir-heat-direct.com/en/tags/flexible/</link>
		<description>Recent content in Flexible on Direct Infrared Heating Supply</description>
		<generator>Hugo</generator>
		<language>en-us</language>
		
		
		
		
			<lastBuildDate>Mon, 01 Jun 2026 02:57:06 +0800</lastBuildDate>
		
			<atom:link href="http://ir-heat-direct.com/en/tags/flexible/index.xml" rel="self" type="application/rss+xml" />
			<item>
				<title>Flexible display drying lamp fab</title>
				<link>http://ir-heat-direct.com/en/posts/flexible-display-drying-lamp-fab/</link>
				<pubDate>Mon, 01 Jun 2026 02:57:06 +0800</pubDate>
				<guid>http://ir-heat-direct.com/en/posts/flexible-display-drying-lamp-fab/</guid>
				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heat-direct.com/images/eeeb9669114c0c0a0b2bef3f902d01a9.png&#34; alt=&#34;Flexible display drying lamp fab&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;On the track, the substrate moves with that steady, predictable rhythm—quiet and repeatable. Photoresist goes down, edge bead is stripped, and the wafer slides into the bake. This is where you lock in the thermal budget: soft bake to pull out the solvent, hard bake to lock adhesion and keep development behavior stable.&#xA;With flexible substrates, you don’t get the same forgiveness you have on glass. Temperature nonuniformity isn’t just a line-width offset. It loads stress into the stack, invites delamination, and kicks up particles that can shadow the whole film. If the bake lamp isn’t performing, you blow your defect budget before the reticle even steps.&lt;/p&gt;</description>
			</item>
	</channel>
</rss>
